FPC / rijid-Flex (kapasite)
PCB rijid (kapasite)
FPC / rijid-Flex (kapasite)
| Kouch konte | 1-28 kouch |  |
| Plastifye kalite | FR-4 (High Tg, Halogen Free, High Frequency) PTFE, BT, Getek, baz aliminyòm base baz kwiv ， KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon |
|
| Epesè Komisyon Konsèy la | 6-240mil | |
| Max Sèvi pwa kwiv | 210um (6oz) pou kouch enteryè 210um (6oz) pou kouch ekstèn | |
| Min gwosè egzèsis mekanik | 0.2mm (0.008 ″) | |
| Rapò aspè | 12: 1 | |
| Gwosè panèl Max | Sigle bò oswa doub kote: 500mm * 1200mm, | |
| Kouch multi: 508mm X 610mm (20 ″ X 24 ″) | ||
| Min liy lajè / espas | 0.076mm / 0.076mm (0.003 "/ 0.003") / 3mil / 3mil | |
| Via kalite twou | Avèg / Antere / Ploge (VOP, VIP ...) | |
| HDI / Microvia | WI | |
| Sifas fini | HASL | |
| Plon gratis HASL | ||
| Immersion Gold (ENIG), Immersion Eten, Immersion Silver | ||
| Organic soudabilite konsèvatif (OSP) / ENTEK | ||
| Flash Gold (Hard Gold plating) | ||
| ENEPIG | ||
| Selektif lò plating, epesè lò jiska 3um (120u ") | ||
| Dwèt lò, kabòn ekri an lèt detache, Peelable S / M | ||
| Koulè mask soude | Vèt, ble, blan, nwa, klè, elatriye. | |
| Enpedans | Single tras, diferans, enpedans koplanè kontwole ± 10% | |
| Plan fini kalite | CNC itinerèr; V-ki fè nòt / Koupe; Punch | |
| Tolerans | Min twou tolerans (NPTH) ± 0.05mm | |
| Min twou tolerans (PTH) ± 0.075mm | ||
| Min modèl tolerans ± 0.05mm |
PCB rijid (kapasite)
| Triye | Atik | Kapasite |  |
|
| Kouch konte | Rijid-flechir PCB | 2 14 | ||
| Flex PCB | 1 ～ 10 | |||
| Komisyon Konsèy la | Min. Epesè | 0.08 +/- 0.03mm | ||
| Maks. Epesè | 6mm | |||
| Maks. Gwosè | 485mm * 1000mm | |||
| Twou & plas | Min.Twou | 0.15mm | ||
| Min.Slot twou | 0.6mm | |||
| Aspè Pwopòsyon | 10: 1 | |||
| Trase | Min.Lajè / espas | 0.05 / 0.05mm | ||
| Tolerans | Trase W / S | ± 0.03mm | ||
| (W / S≥0.3mm: ± 10%) | ||||
| Twou nan twou | ± 0.075mm | |||
| Dimansyon twou | ± 0.075mm | |||
| Enpedans | 0 ≤ Valè ≤ 50Ω: ± 5Ω 50Ω ≤ Valè: ± 10% Ω | |||
| Materyèl | Espesifikasyon Basefilm | PI: 3mil 2mil 1mil 0.8mil 0.5mil | ||
| ED&RA Cu: 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ | ||||
| Basefilm Main founisè | Shengyi / Taiflex / Dupont / Doosan / Thinflex | |||
| Espesifikasyon Coverlay | PI: 2mil 1mil 0.5mil | |||
| LPI Koulè | Vèt / jòn / blan / nwa / ble / wouj | |||
| PI Stiffener | T: 25um ～ 250um | |||
| FR4 Stiffener | T: 100um ～ 2000um | |||
| SUS Stiffener | T: 100um ～ 400um | |||
| AL Stiffener | T: 100um ～ 1600um | |||
| Tape | 3M / Tesa / Nitto | |||
| EMI pwoteksyon | Silver fim / Copper / Silver lank | |||
| Sifas fini | OSP | 0.1 - 0.3um | ||
| HASL | Sn: 5um - 40um | |||
| HASL (Leed gratis) | Sn: 5um - 40um | |||
| ENEPIG | Ni: 1.0 - 6.0um | |||
| Ba: 0.015-0.10um | ||||
| Au: 0.015 - 0.10um | ||||
| PLATING difisil lò | Ni: 1.0 - 6.0um | |||
| Au: 0.02um - 1um | ||||
| Flash lò | Ni: 1.0 - 6.0um | |||
| Au: 0.02um - 0.1um | ||||
| ENIG | Ni: 1.0 - 6.0um | |||
| Au: 0.015um - 0.10um | ||||
| Ajan imèsyon | Ag: 0.1 - 0.3um | |||
| PLATING Eten | Sn: 5um - 35um | |||